Distributed Microscale Brain Implants with Wireless Power Transfer and Mbps Bi-directional Networked Communications

Vincent W. Leung, Lingxiao Cui, Sravya Alluri, Jihun Lee, Jiannan Huang, Ethan Mok, Steven Shellhammer, Ramesh R. Rao, Peter M. Asbeck, Patrick P. Mercier, Lawrence E. Larson, Arto V. Nurmikko, Farah Laiwalla. Distributed Microscale Brain Implants with Wireless Power Transfer and Mbps Bi-directional Networked Communications. In IEEE Custom Integrated Circuits Conference, CICC 2019, Austin, TX, USA, April 14-17, 2019. pages 1-4, IEEE, 2019. [doi]

@inproceedings{LeungCALHMSRAML19,
  title = {Distributed Microscale Brain Implants with Wireless Power Transfer and Mbps Bi-directional Networked Communications},
  author = {Vincent W. Leung and Lingxiao Cui and Sravya Alluri and Jihun Lee and Jiannan Huang and Ethan Mok and Steven Shellhammer and Ramesh R. Rao and Peter M. Asbeck and Patrick P. Mercier and Lawrence E. Larson and Arto V. Nurmikko and Farah Laiwalla},
  year = {2019},
  doi = {10.1109/CICC.2019.8780289},
  url = {https://doi.org/10.1109/CICC.2019.8780289},
  researchr = {https://researchr.org/publication/LeungCALHMSRAML19},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {IEEE Custom Integrated Circuits Conference, CICC 2019, Austin, TX, USA, April 14-17, 2019},
  publisher = {IEEE},
  isbn = {978-1-5386-9395-7},
}