Ming Li, Xiaoxu Kang, Xiaolan Zhong. A Novel Etch Scheme to Form Sloped Profile by Standard Anisotropic CMOS Process. In Fan Ye, Ting-Ao Tang, editors, 14th IEEE International Conference on ASIC, ASICON 2021, Kunming, China, October 26-29, 2021. pages 1-4, IEEE, 2021. [doi]
@inproceedings{LiKZ21a, title = {A Novel Etch Scheme to Form Sloped Profile by Standard Anisotropic CMOS Process}, author = {Ming Li and Xiaoxu Kang and Xiaolan Zhong}, year = {2021}, doi = {10.1109/ASICON52560.2021.9620422}, url = {https://doi.org/10.1109/ASICON52560.2021.9620422}, researchr = {https://researchr.org/publication/LiKZ21a}, cites = {0}, citedby = {0}, pages = {1-4}, booktitle = {14th IEEE International Conference on ASIC, ASICON 2021, Kunming, China, October 26-29, 2021}, editor = {Fan Ye and Ting-Ao Tang}, publisher = {IEEE}, isbn = {978-1-6654-3867-4}, }