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An Electromechanical Model and Simulation for Test Process of the Wafer Probe

Junhui Li, Hailong Liao, Dasong Ge, Can Zhou, Chengdi Xiao, Qing Tian, Wenhui Zhu. An Electromechanical Model and Simulation for Test Process of the Wafer Probe. IEEE Transactions on Industrial Electronics, 64(2):1284-1291, 2017. [doi]

Authors

Junhui Li

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Hailong Liao

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Dasong Ge

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Can Zhou

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Chengdi Xiao

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Qing Tian

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Wenhui Zhu

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