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Efficient Simulation of IC Packages with TEC Based on Adaptive Segmented Method and Spatially-Aware Thermal Neural Network

Longfei Li, Xinyue Li, Shunxiang Lan, Liang Chen, Haibao Chen, Min Tang. Efficient Simulation of IC Packages with TEC Based on Adaptive Segmented Method and Spatially-Aware Thermal Neural Network. In 31st Asia and South Pacific Design Automation Conference, ASP-DAC 2026, Lantau, Hong Kong, January 19-22, 2026. pages 1393-1399, IEEE, 2026. [doi]

Authors

Longfei Li

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Xinyue Li

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Shunxiang Lan

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Liang Chen

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Haibao Chen

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Min Tang

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