Cheng Li, Na Lu, Yang Li, Yao Wei, Ning Jin. Innovative Solutions and Applications of 5G Smart Factory for Chip Packaging. In International Wireless Communications and Mobile Computing, IWCMC 2023, Marrakesh, Morocco, June 19-23, 2023. pages 717-721, IEEE, 2023. [doi]
@inproceedings{LiLLWJ23,
title = {Innovative Solutions and Applications of 5G Smart Factory for Chip Packaging},
author = {Cheng Li and Na Lu and Yang Li and Yao Wei and Ning Jin},
year = {2023},
doi = {10.1109/IWCMC58020.2023.10183123},
url = {https://doi.org/10.1109/IWCMC58020.2023.10183123},
researchr = {https://researchr.org/publication/LiLLWJ23},
cites = {0},
citedby = {0},
pages = {717-721},
booktitle = {International Wireless Communications and Mobile Computing, IWCMC 2023, Marrakesh, Morocco, June 19-23, 2023},
publisher = {IEEE},
isbn = {979-8-3503-3339-8},
}