Shijie Li, Ruichang Ma, Mingxing Deng, Jiamin Xue, Wei Deng, Baoyong Chi, Haikun Jia. INVITED PAPER: A 312.5Mbps-32Gbps JESD204C Wireline Transceiver Back-Compatible with JESD204B in 28nm CMOS. In IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023, Hefei, China, October 27-29, 2023. pages 21-24, IEEE, 2023. [doi]
@inproceedings{LiMDXDCJ23,
title = {INVITED PAPER: A 312.5Mbps-32Gbps JESD204C Wireline Transceiver Back-Compatible with JESD204B in 28nm CMOS},
author = {Shijie Li and Ruichang Ma and Mingxing Deng and Jiamin Xue and Wei Deng and Baoyong Chi and Haikun Jia},
year = {2023},
doi = {10.1109/ICTA60488.2023.10364309},
url = {https://doi.org/10.1109/ICTA60488.2023.10364309},
researchr = {https://researchr.org/publication/LiMDXDCJ23},
cites = {0},
citedby = {0},
pages = {21-24},
booktitle = {IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023, Hefei, China, October 27-29, 2023},
publisher = {IEEE},
isbn = {979-8-3503-4428-8},
}