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The Mathematical Model and Novel Final Test System for Wafer-Level Packaging

Junhui Li, Wenya Tian, Hailong Liao, Can Zhou, Xiaohe Liu, Wenhui Zhu. The Mathematical Model and Novel Final Test System for Wafer-Level Packaging. IEEE Trans. Industrial Informatics, 13(4):1817-1824, 2017. [doi]

Authors

Junhui Li

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Wenya Tian

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Hailong Liao

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Can Zhou

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Xiaohe Liu

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Wenhui Zhu

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