Microarchitecture level power and thermal simulation considering temperature dependent leakage model - researchr publication authors

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Weiping Liao, Fei Li, Lei He. Microarchitecture level power and thermal simulation considering temperature dependent leakage model. In Ingrid Verbauwhede, Hyung Roh, editors, Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003, Seoul, Korea, August 25-27, 2003. pages 211-216, ACM, 2003. [doi]

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