Xiongfei Liao, Jun Zhou, Xin Liu. Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]
@inproceedings{LiaoZL11-0,
title = {Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs},
author = {Xiongfei Liao and Jun Zhou and Xin Liu},
year = {2011},
doi = {10.1109/3DIC.2012.6263036},
url = {http://dx.doi.org/10.1109/3DIC.2012.6263036},
researchr = {https://researchr.org/publication/LiaoZL11-0},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}