Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations

Chi-Pu Lin, Chih-Ming Chen. Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations. Microelectronics Reliability, 52(2):385-390, 2012. [doi]

Authors

Chi-Pu Lin

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Chih-Ming Chen

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