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BCB-to-oxide bonding technology for 3D integration

S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen. BCB-to-oxide bonding technology for 3D integration. Microelectronics Reliability, 52(2):352-355, 2012. [doi]

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S. L. Lin

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W. C. Huang

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C. T. Ko

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Kuan-Neng Chen

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