Effects of length scaling on electromigration in dual-damascene copper interconnects

M. H. Lin, M. T. Lin, Tahui Wang. Effects of length scaling on electromigration in dual-damascene copper interconnects. Microelectronics Reliability, 48(4):569-577, 2008. [doi]

Authors

M. H. Lin

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M. T. Lin

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Tahui Wang

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