ModulePacking: A Top-Down Generative Design Approach for Modular Key Plans

Xiao Lin, Peiyang Su, Weisheng Lu, Hongling Guo. ModulePacking: A Top-Down Generative Design Approach for Modular Key Plans. J. Comput. Civ. Eng., 39(1), 2025. [doi]

@article{LinSLG25,
  title = {ModulePacking: A Top-Down Generative Design Approach for Modular Key Plans},
  author = {Xiao Lin and Peiyang Su and Weisheng Lu and Hongling Guo},
  year = {2025},
  doi = {10.1061/jccee5.cpeng-6078},
  url = {https://doi.org/10.1061/jccee5.cpeng-6078},
  researchr = {https://researchr.org/publication/LinSLG25},
  cites = {0},
  citedby = {0},
  journal = {J. Comput. Civ. Eng.},
  volume = {39},
  number = {1},
}