Wei-Shin Lin, Yung-Cheng Wang, Wen-Chi Hsiao, Bean-Yin Lee. Grinding performance analysis of diamond wheel for groove grinding. In 8th IEEE International Conference on Control and Automation, ICCA 2010, Xiamen, China, June 9-11, 2010. pages 608-613, IEEE, 2010. [doi]
@inproceedings{LinWHL10,
title = {Grinding performance analysis of diamond wheel for groove grinding},
author = {Wei-Shin Lin and Yung-Cheng Wang and Wen-Chi Hsiao and Bean-Yin Lee},
year = {2010},
doi = {10.1109/ICCA.2010.5524334},
url = {http://dx.doi.org/10.1109/ICCA.2010.5524334},
researchr = {https://researchr.org/publication/LinWHL10},
cites = {0},
citedby = {0},
pages = {608-613},
booktitle = {8th IEEE International Conference on Control and Automation, ICCA 2010, Xiamen, China, June 9-11, 2010},
publisher = {IEEE},
isbn = {978-1-4244-5196-8},
}