The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process

Lin Lin, Jun Wang, Lei Wang, Wenqi Zhang. The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process. Microelectronics Reliability, 65:198-204, 2016. [doi]

Authors

Lin Lin

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Jun Wang

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Lei Wang

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Wenqi Zhang

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