Johan Liu. Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5. Microelectronics Reliability, 43(4):681-683, 2003. [doi]
@article{Liu03:30,
title = {Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5},
author = {Johan Liu},
year = {2003},
doi = {10.1016/S0026-2714(03)00033-7},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00033-7},
researchr = {https://researchr.org/publication/Liu03%3A30},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {4},
pages = {681-683},
}