Initial Experience with 3D XPoint Main Memory

Jihang Liu, Shimin Chen. Initial Experience with 3D XPoint Main Memory. In 35th IEEE International Conference on Data Engineering Workshops, ICDE Workshops 2019, Macao, China, April 8-12, 2019. pages 300-305, IEEE, 2019. [doi]

@inproceedings{LiuC19-18,
  title = {Initial Experience with 3D XPoint Main Memory},
  author = {Jihang Liu and Shimin Chen},
  year = {2019},
  doi = {10.1109/ICDEW.2019.00009},
  url = {https://doi.org/10.1109/ICDEW.2019.00009},
  researchr = {https://researchr.org/publication/LiuC19-18},
  cites = {0},
  citedby = {0},
  pages = {300-305},
  booktitle = {35th IEEE International Conference on Data Engineering Workshops, ICDE Workshops 2019, Macao, China, April 8-12, 2019},
  publisher = {IEEE},
  isbn = {978-1-7281-0890-2},
}