Effective congestion reduction for IC package substrate routing

Shenghua Liu, Guoqiang Chen, Tom Tong Jing, Lei He, Robi Dutta, Xianlong Hong. Effective congestion reduction for IC package substrate routing. ACM Trans. Design Autom. Electr. Syst., 15(3), 2010. [doi]

@article{LiuCJHDH10,
  title = {Effective congestion reduction for IC package substrate routing},
  author = {Shenghua Liu and Guoqiang Chen and Tom Tong Jing and Lei He and Robi Dutta and Xianlong Hong},
  year = {2010},
  doi = {10.1145/1754405.1754412},
  url = {http://doi.acm.org/10.1145/1754405.1754412},
  tags = {routing},
  researchr = {https://researchr.org/publication/LiuCJHDH10},
  cites = {0},
  citedby = {0},
  journal = {ACM Trans. Design Autom. Electr. Syst.},
  volume = {15},
  number = {3},
}