Kun Liu, Changshu Huang, Qiong Yu, Jianye Lu, Yansheng Zou. The Thermal Model of IGBT Junction Temperature Calculation and Application in VSC-HVDC Projects. In ICITEE-2019: 2nd International Conference on Information Technologies and Electrical Engineering, Zhuzhou, Hunan, China, December 6-7, 2019. ACM, 2019. [doi]
@inproceedings{LiuHYLZ19,
title = {The Thermal Model of IGBT Junction Temperature Calculation and Application in VSC-HVDC Projects},
author = {Kun Liu and Changshu Huang and Qiong Yu and Jianye Lu and Yansheng Zou},
year = {2019},
doi = {10.1145/3386415.3387008},
url = {https://doi.org/10.1145/3386415.3387008},
researchr = {https://researchr.org/publication/LiuHYLZ19},
cites = {0},
citedby = {0},
booktitle = {ICITEE-2019: 2nd International Conference on Information Technologies and Electrical Engineering, Zhuzhou, Hunan, China, December 6-7, 2019},
publisher = {ACM},
isbn = {978-1-4503-7293-0},
}