Jialing Liu, Jiang Wei, Tengjian Zou. Bridging and Bonding: Exploring the Influence of Community-Level Networks on Product Innovation in Video Game Communities. IEEE Trans. Engineering Management, 71:6044-6062, 2024. [doi]
@article{LiuWZ24-8,
title = {Bridging and Bonding: Exploring the Influence of Community-Level Networks on Product Innovation in Video Game Communities},
author = {Jialing Liu and Jiang Wei and Tengjian Zou},
year = {2024},
doi = {10.1109/TEM.2024.3375312},
url = {https://doi.org/10.1109/TEM.2024.3375312},
researchr = {https://researchr.org/publication/LiuWZ24-8},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Engineering Management},
volume = {71},
pages = {6044-6062},
}