Effect of substrate flexibility on solder joint reliability

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard. Effect of substrate flexibility on solder joint reliability. Microelectronics Reliability, 42(12):1883-1891, 2002. [doi]

Authors

Xingsheng Liu

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Shuangyan Xu

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Guo-Quan Lu

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David A. Dillard

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