Yu-lung Lo, Chih-Chiang Tsao. Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor. Microelectronics Reliability, 42(2):285-291, 2002. [doi]
@article{LoT02,
title = {Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor},
author = {Yu-lung Lo and Chih-Chiang Tsao},
year = {2002},
doi = {10.1016/S0026-2714(01)00246-3},
url = {http://dx.doi.org/10.1016/S0026-2714(01)00246-3},
researchr = {https://researchr.org/publication/LoT02},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {42},
number = {2},
pages = {285-291},
}