Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly

Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne. Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. Microelectronics Reliability, 87:97-105, 2018. [doi]

Authors

Melina Lofrano

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Vladimir Cherman

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Mario Gonzalez

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Eric Beyne

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