Composite Wafer Defect Recognition Framework Based on Multiview Dynamic Feature Enhancement With Class-Specific Classifier

Wenjun Luo, Huan Wang 0015. Composite Wafer Defect Recognition Framework Based on Multiview Dynamic Feature Enhancement With Class-Specific Classifier. IEEE T. Instrumentation and Measurement, 72:1-12, 2023. [doi]

@article{LuoW23-0,
  title = {Composite Wafer Defect Recognition Framework Based on Multiview Dynamic Feature Enhancement With Class-Specific Classifier},
  author = {Wenjun Luo and Huan Wang 0015},
  year = {2023},
  doi = {10.1109/TIM.2023.3261924},
  url = {https://doi.org/10.1109/TIM.2023.3261924},
  researchr = {https://researchr.org/publication/LuoW23-0},
  cites = {0},
  citedby = {0},
  journal = {IEEE T. Instrumentation and Measurement},
  volume = {72},
  pages = {1-12},
}