A Case Study of Utilizing the SMT Solver for Deployment Optimization of an IEC 61499-based Application

Tuojian Lyu, Jan Olaf Blech, Valeriy Vyatkin. A Case Study of Utilizing the SMT Solver for Deployment Optimization of an IEC 61499-based Application. In 30th IEEE International Symposium on Industrial Electronics, ISIE 2021, Kyoto, Japan, June 20-23, 2021. pages 1-6, IEEE, 2021. [doi]

Authors

Tuojian Lyu

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Jan Olaf Blech

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Valeriy Vyatkin

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