Experiments and Hygrothermal Stress Analysis for a QFN Package - researchr publication authors

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Lifan Ma, Jun Wang. Experiments and Hygrothermal Stress Analysis for a QFN Package. In IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023, Hefei, China, October 27-29, 2023. pages 194-195, IEEE, 2023. [doi]

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