Carol McDonald, Randy K. Rannow, Dinesh Pai, Alice Bullas, Alfredo Ballester. IEEE SA Industry Connections 3D Body Processing Working Group and IEEE P3141 Standard for 3D Body Processing-Part 2. IEEE Consumer Electronics Magazine, 9(6):97-99, 2020. [doi]
@article{McDonaldRPBB20a,
title = {IEEE SA Industry Connections 3D Body Processing Working Group and IEEE P3141 Standard for 3D Body Processing-Part 2},
author = {Carol McDonald and Randy K. Rannow and Dinesh Pai and Alice Bullas and Alfredo Ballester},
year = {2020},
doi = {10.1109/MCE.2020.2997556},
url = {https://doi.org/10.1109/MCE.2020.2997556},
researchr = {https://researchr.org/publication/McDonaldRPBB20a},
cites = {0},
citedby = {0},
journal = {IEEE Consumer Electronics Magazine},
volume = {9},
number = {6},
pages = {97-99},
}