Eve McGlynn, Rupam Das, Hadi Heidari. Encapsulated Magnetoelectric Composites for Wirelessly Powered Brain Implantable Devices. In 27th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2020, Glasgow, Scotland, UK, November 23-25, 2020. pages 1-4, IEEE, 2020. [doi]
@inproceedings{McGlynnDH20,
title = {Encapsulated Magnetoelectric Composites for Wirelessly Powered Brain Implantable Devices},
author = {Eve McGlynn and Rupam Das and Hadi Heidari},
year = {2020},
doi = {10.1109/ICECS49266.2020.9294847},
url = {https://doi.org/10.1109/ICECS49266.2020.9294847},
researchr = {https://researchr.org/publication/McGlynnDH20},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {27th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2020, Glasgow, Scotland, UK, November 23-25, 2020},
publisher = {IEEE},
isbn = {978-1-7281-6044-3},
}