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On Through Silicon Vias as used in three dimensional integrated circuits

Robert Minvielle, Magdy Bayoumi. On Through Silicon Vias as used in three dimensional integrated circuits. In 4th Annual International Conference on Energy Aware Computing Systems and Applications, ICEAC 2013, Istanbul, Turkey, December 16-18, 2013. pages 125-130, IEEE, 2013. [doi]

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Robert Minvielle

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Magdy Bayoumi

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