Energy scavenging and storage using through silicon vias to reduce power consumption in 3D ICs - researchr publication authors

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Robert Minvielle, Magdy Bayoumi. Energy scavenging and storage using through silicon vias to reduce power consumption in 3D ICs. In 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014, Marseille, France, December 7-10, 2014. pages 219-222, IEEE, 2014. [doi]

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