A manufacturing system simulation of semiconductor packaging substrate - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Dug Hee Moon, Kyeong Wook Shin, Chul Soon Park, Dong-Soo Kim. A manufacturing system simulation of semiconductor packaging substrate. In Gabriel Andrés Wainer, Clifford A. Shaffer, Robert M. McGraw, Michael J. Chinni, editors, Proceedings of the 2009 Spring Simulation Multiconference, SpringSim 2009, San Diego, California, USA, March 22-27, 2009. SCS/ACM, 2009. [doi]

This author has not been identified. Look up 'Dug Hee Moon' in GoogleThis author has not been identified. Look up 'Kyeong Wook Shin' in GoogleThis author has not been identified. Look up 'Chul Soon Park' in GoogleThis author has not been identified. Look up 'Dong-Soo Kim' in Google

runs on WebDSL