Study of aluminum thermomigration as a low thermal budget technique for innovative power devices

B. Morillon, Jean-Marie Dilhac, Christian Ganibal, C. Anceau. Study of aluminum thermomigration as a low thermal budget technique for innovative power devices. Microelectronics Reliability, 43(4):565-569, 2003. [doi]

Authors

B. Morillon

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Jean-Marie Dilhac

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Christian Ganibal

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C. Anceau

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