Electromigration and electrochemical reaction mixed failure mechanism in gold interconnection system

Hide Murayama, Makoto Yamazaki, Shigeru Nakajima. Electromigration and electrochemical reaction mixed failure mechanism in gold interconnection system. Microelectronics Reliability, 41(8):1265-1272, 2001. [doi]

@article{MurayamaYN01,
  title = {Electromigration and electrochemical reaction mixed failure mechanism in gold interconnection system},
  author = {Hide Murayama and Makoto Yamazaki and Shigeru Nakajima},
  year = {2001},
  doi = {10.1016/S0026-2714(01)00112-3},
  url = {http://dx.doi.org/10.1016/S0026-2714(01)00112-3},
  researchr = {https://researchr.org/publication/MurayamaYN01},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {41},
  number = {8},
  pages = {1265-1272},
}