Habib Nassar, Ravinder Dahiya. Fused Deposition Modeling-Based 3D-Printed Electrical Interconnects and Circuits. Adv. Intell. Syst., 3(12):2100102, 2021. [doi]
@article{NassarD21,
title = {Fused Deposition Modeling-Based 3D-Printed Electrical Interconnects and Circuits},
author = {Habib Nassar and Ravinder Dahiya},
year = {2021},
doi = {10.1002/aisy.202100102},
url = {https://doi.org/10.1002/aisy.202100102},
researchr = {https://researchr.org/publication/NassarD21},
cites = {0},
citedby = {0},
journal = {Adv. Intell. Syst.},
volume = {3},
number = {12},
pages = {2100102},
}