Mu Nie, Wen Jiang, Wankou Yang, Senling Wang, Xiaoqing Wen, Tianming Ni. Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning. In 32nd IEEE Asian Test Symposium, ATS 2023, Beijing, China, October 14-17, 2023. pages 1-6, IEEE, 2023. [doi]
@inproceedings{NieJYWWN23,
title = {Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning},
author = {Mu Nie and Wen Jiang and Wankou Yang and Senling Wang and Xiaoqing Wen and Tianming Ni},
year = {2023},
doi = {10.1109/ATS59501.2023.10317989},
url = {https://doi.org/10.1109/ATS59501.2023.10317989},
researchr = {https://researchr.org/publication/NieJYWWN23},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {32nd IEEE Asian Test Symposium, ATS 2023, Beijing, China, October 14-17, 2023},
publisher = {IEEE},
isbn = {979-8-3503-0310-0},
}