Condition-based dummy fill insertion method based on ECP and CMP predictive models

Izumi Nitta, Yuji Kanazawa, Daisuke Fukuda, Toshiyuki Shibuya, Naoki Idani, Masaru Ito, Osamu Yamasaki, Norihiro Harada, Takanori Hiramoto. Condition-based dummy fill insertion method based on ECP and CMP predictive models. In 11th International Symposium on Quality of Electronic Design (ISQED 2010), 22-24 March 2010, San Jose, CA, USA. pages 198-205, IEEE, 2010. [doi]