K. Nötzold, J. Graf, Roland Müller-Fiedler. A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors. Microelectronics Reliability, 48(8-9):1562-1566, 2008. [doi]
@article{NotzoldGM08, title = {A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors}, author = {K. Nötzold and J. Graf and Roland Müller-Fiedler}, year = {2008}, doi = {10.1016/j.microrel.2008.07.001}, url = {http://dx.doi.org/10.1016/j.microrel.2008.07.001}, researchr = {https://researchr.org/publication/NotzoldGM08}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {48}, number = {8-9}, pages = {1562-1566}, }