Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, Takeshi Kawano, Makoto Ishida, Ippei Akita. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors, 15(12):31821-31832, 2015. [doi]
@article{OkabeJYKIA15,
title = {Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems},
author = {Kenji Okabe and Horagodage Prabhath Jeewan and Shota Yamagiwa and Takeshi Kawano and Makoto Ishida and Ippei Akita},
year = {2015},
doi = {10.3390/s151229885},
url = {http://dx.doi.org/10.3390/s151229885},
researchr = {https://researchr.org/publication/OkabeJYKIA15},
cites = {0},
citedby = {0},
journal = {Sensors},
volume = {15},
number = {12},
pages = {31821-31832},
}