Boon-Yaik Ooi, Woan Lin Beh, Xin-Yi Kh'Ng, Soung-Yue Liew, Shervin Shirmohammadi. Using Compressive Sampling to Fill Interbatch Data Gap From Low-Cost IoT Vibration Sensor. IEEE Internet of Things Journal, 9(12):9820-9830, 2022. [doi]
@article{OoiBKLS22,
title = {Using Compressive Sampling to Fill Interbatch Data Gap From Low-Cost IoT Vibration Sensor},
author = {Boon-Yaik Ooi and Woan Lin Beh and Xin-Yi Kh'Ng and Soung-Yue Liew and Shervin Shirmohammadi},
year = {2022},
doi = {10.1109/JIOT.2022.3151051},
url = {https://doi.org/10.1109/JIOT.2022.3151051},
researchr = {https://researchr.org/publication/OoiBKLS22},
cites = {0},
citedby = {0},
journal = {IEEE Internet of Things Journal},
volume = {9},
number = {12},
pages = {9820-9830},
}