Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications

J. P. Ousten, Zoubir Khatir. Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications. Microelectronics Reliability, 51(9-11):1830-1835, 2011. [doi]

@article{OustenK11,
  title = {Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications},
  author = {J. P. Ousten and Zoubir Khatir},
  year = {2011},
  doi = {10.1016/j.microrel.2011.07.066},
  url = {http://dx.doi.org/10.1016/j.microrel.2011.07.066},
  researchr = {https://researchr.org/publication/OustenK11},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {51},
  number = {9-11},
  pages = {1830-1835},
}