C. T. Pan, Y.-C. Chen, S. Y. Wang, Y. T. Cheng, C. K. Yen, Y.-L. Lin, W. C. Shih. TSV by 355 UV laser for 4G component packaging with micro-electroforming. Microelectronics Reliability, 78:331-338, 2017. [doi]
@article{PanCWCYLS17,
title = {TSV by 355 UV laser for 4G component packaging with micro-electroforming},
author = {C. T. Pan and Y.-C. Chen and S. Y. Wang and Y. T. Cheng and C. K. Yen and Y.-L. Lin and W. C. Shih},
year = {2017},
doi = {10.1016/j.microrel.2017.09.023},
url = {https://doi.org/10.1016/j.microrel.2017.09.023},
researchr = {https://researchr.org/publication/PanCWCYLS17},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {78},
pages = {331-338},
}