Education Abstract: Thermal Challenges and Mitigation in 3D DRAM

Preeti Ranjan Panda, Shailja Pandey. Education Abstract: Thermal Challenges and Mitigation in 3D DRAM. In International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2023, Hamburg, Germany, September 17-22, 2023. pages 40-41, IEEE, 2023. [doi]

@inproceedings{PandaP23,
  title = {Education Abstract: Thermal Challenges and Mitigation in 3D DRAM},
  author = {Preeti Ranjan Panda and Shailja Pandey},
  year = {2023},
  url = {https://ieeexplore.ieee.org/document/10317834},
  researchr = {https://researchr.org/publication/PandaP23},
  cites = {0},
  citedby = {0},
  pages = {40-41},
  booktitle = {International Conference on Hardware/Software Codesign and System Synthesis, CODES+ISSS 2023, Hamburg, Germany, September 17-22, 2023},
  publisher = {IEEE},
  isbn = {979-8-4007-0289-1},
}