WiP Abstract: Message Bridging Structure Between HLA and DDS for Integrating Cyber-Physical Systems

Yunjung Park, Dugki Min. WiP Abstract: Message Bridging Structure Between HLA and DDS for Integrating Cyber-Physical Systems. In 2012 IEEE/ACM Third International Conference on Cyber-Physical Systems, Beijing, China, April 17-19, 2012. pages 210, IEEE, 2012. [doi]

@inproceedings{ParkM12,
  title = {WiP Abstract: Message Bridging Structure Between HLA and DDS for Integrating Cyber-Physical Systems},
  author = {Yunjung Park and Dugki Min},
  year = {2012},
  doi = {10.1109/ICCPS.2012.33},
  url = {http://doi.ieeecomputersociety.org/10.1109/ICCPS.2012.33},
  researchr = {https://researchr.org/publication/ParkM12},
  cites = {0},
  citedby = {0},
  pages = {210},
  booktitle = {2012 IEEE/ACM Third International Conference on Cyber-Physical Systems, Beijing, China, April 17-19, 2012},
  publisher = {IEEE},
  isbn = {978-1-4673-1537-1},
}