Module packaging effects on MEMS airbag sensor performance for automobiles

Dong-Hyun Park, Sojin Shin, Yeong K. Kim. Module packaging effects on MEMS airbag sensor performance for automobiles. Microelectronics Reliability, 79:328-335, 2017. [doi]

Authors

Dong-Hyun Park

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Sojin Shin

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Yeong K. Kim

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