Ehsan Parsa, Hao Huang, Abhijit Dasgupta. Multi-physics simulations for combined temperature/humidity loading of potted electronic assemblies. Microelectronics Reliability, 54(6-7):1182-1191, 2014. [doi]
@article{ParsaHD14,
title = {Multi-physics simulations for combined temperature/humidity loading of potted electronic assemblies},
author = {Ehsan Parsa and Hao Huang and Abhijit Dasgupta},
year = {2014},
doi = {10.1016/j.microrel.2014.02.016},
url = {http://dx.doi.org/10.1016/j.microrel.2014.02.016},
researchr = {https://researchr.org/publication/ParsaHD14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {6-7},
pages = {1182-1191},
}