Dev Paul. A closer look at bonding grounding electrodes (NEC 2011, article 250 requirements). In 2011 IEEE Industry Applications Society Annual Meeting, Orlando, FL, USA, October 9-13, 2011. pages 1-7, IEEE, 2011. [doi]
@inproceedings{Paul11-3,
title = {A closer look at bonding grounding electrodes (NEC 2011, article 250 requirements)},
author = {Dev Paul},
year = {2011},
doi = {10.1109/IAS.2011.6074262},
url = {http://dx.doi.org/10.1109/IAS.2011.6074262},
researchr = {https://researchr.org/publication/Paul11-3},
cites = {0},
citedby = {0},
pages = {1-7},
booktitle = {2011 IEEE Industry Applications Society Annual Meeting, Orlando, FL, USA, October 9-13, 2011},
publisher = {IEEE},
isbn = {978-1-4244-9498-9},
}