Optical and electronic packaging process for silicon photonic systems

Nicola Pavarelli, Jun Su Lee, Marc Rensing, Cormac Eason, Peter A. O'Brien. Optical and electronic packaging process for silicon photonic systems. In The European Conference on Optical Communication, ECOC 2014, Cannes, France, September 21-25, 2014. pages 1-4, IEEE, 2014. [doi]

@inproceedings{PavarelliLREO14,
  title = {Optical and electronic packaging process for silicon photonic systems},
  author = {Nicola Pavarelli and Jun Su Lee and Marc Rensing and Cormac Eason and Peter A. O'Brien},
  year = {2014},
  doi = {10.1109/ECOC.2014.6964237},
  url = {https://doi.org/10.1109/ECOC.2014.6964237},
  researchr = {https://researchr.org/publication/PavarelliLREO14},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {The European Conference on Optical Communication, ECOC 2014, Cannes, France, September 21-25, 2014},
  publisher = {IEEE},
}