Analysis on Nondispersive Infrared Device Characteristics Using Thermopile

Son Pham, Anh Dinh. Analysis on Nondispersive Infrared Device Characteristics Using Thermopile. In 2019 IEEE Canadian Conference of Electrical and Computer Engineering, CCECE 2019, Edmonton, AB, Canada, May 5-8, 2019. pages 1-4, IEEE, 2019. [doi]

Authors

Son Pham

This author has not been identified. Look up 'Son Pham' in Google

Anh Dinh

This author has not been identified. Look up 'Anh Dinh' in Google