A Low-Loss and High-Isolation Transformer-Based mm-Wave SPDT with Integrated Fan-out Wafer Level Packaging

Xing Quan, Jiang Luo, Guodong Su, Kai Jing, Jinsong Zhan. A Low-Loss and High-Isolation Transformer-Based mm-Wave SPDT with Integrated Fan-out Wafer Level Packaging. Journal of Circuits, Systems, and Computers, 29(7), 2020. [doi]

@article{QuanLSJZ20,
  title = {A Low-Loss and High-Isolation Transformer-Based mm-Wave SPDT with Integrated Fan-out Wafer Level Packaging},
  author = {Xing Quan and Jiang Luo and Guodong Su and Kai Jing and Jinsong Zhan},
  year = {2020},
  doi = {10.1142/S0218126620501157},
  url = {https://doi.org/10.1142/S0218126620501157},
  researchr = {https://researchr.org/publication/QuanLSJZ20},
  cites = {0},
  citedby = {0},
  journal = {Journal of Circuits, Systems, and Computers},
  volume = {29},
  number = {7},
}