Fusion of VR and teleoperation for innovative near-presence laboratory experience in engineering education

Sushanta Mohan Rakshit, Subharthi Banerjee, Michael Hempel, Hamid Sharif. Fusion of VR and teleoperation for innovative near-presence laboratory experience in engineering education. In IEEE International Conference on Electro Information Technology, EIT 2017, Lincoln, NE, USA, May 14-17, 2017. pages 376-381, IEEE, 2017. [doi]

@inproceedings{RakshitBHS17,
  title = {Fusion of VR and teleoperation for innovative near-presence laboratory experience in engineering education},
  author = {Sushanta Mohan Rakshit and Subharthi Banerjee and Michael Hempel and Hamid Sharif},
  year = {2017},
  doi = {10.1109/EIT.2017.8053390},
  url = {https://doi.org/10.1109/EIT.2017.8053390},
  researchr = {https://researchr.org/publication/RakshitBHS17},
  cites = {0},
  citedby = {0},
  pages = {376-381},
  booktitle = {IEEE International Conference on Electro Information Technology, EIT 2017, Lincoln, NE, USA, May 14-17, 2017},
  publisher = {IEEE},
  isbn = {978-1-5090-4767-3},
}